針對高標準的芯片貼裝應用，提供高技術力的多功能貼片固晶系統以及高底定制化的方案服務，尤其是對于超薄存儲芯片的堆疊裝片具有突出表現。多功能全自動芯片貼片固晶機 TB-1000

精密倒裝芯片貼片機 CB-610特點： Correspond to fine pitch of electrodes with mounting accuracy ± 1μm Correspond yo ultra-low load（0.049N）to high load (490N）without head replacement

超高精度倒裝芯片貼片機 CB-700特點： ? Ultra-low load, high-accuracy bonding ? Real-time control is possible in the low load range. As a result, bump height variation become minimized.